


Chip Ceramic Capacitor
Applicable to electronic devices in military equipment, aerospace, automotive electronics, etc. Class I is used in resonant circuits, coupling circuits, and circuits requiring low loss, high insulation resistance, and high stability of capacitance; Class II is commonly used in bypass, filtering, low-frequency coupling, and circuits with high capacitance but less stringent stability requirements.
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Chip Ceramic Capacitor
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Product Description
Product Features
● Using advanced wet process, inner electrode made of palladium-silver, high dielectric density, high insulation resistance, good resistance to thermal shock;
● Ensures high product reliability and strict process and test conditions, with different types of lead electrode options:
(1) Three-layer (nickel barrier) terminal J: general or standard military requirements;
(2) Three-layer (nickel barrier) lead-tin (10% lead) terminal A: high reliability requirements;
(3) Palladium-silver terminal F: conductive adhesive bonding process, welding process;
(4) Three-layer (nickel barrier) flexible lead-tin (10% lead) terminal H: for high stress conditions (-65℃ to 150℃ shock test).
● 100% of products pass temperature cycling shock; 100 hours of high temperature load aging; DPA test and other reliability tests and inspections.
Standards Compliance
General specification: GJB192B-2011 "General Specification for Unencapsulated Multilayer Ceramic Capacitors with Reliability Indicators";
Product Applications
Suitable for electronic equipment in military equipment, aerospace, automotive electronics, etc. Class I is used in resonant circuits, coupling circuits, and circuits requiring low loss, high insulation resistance, and high stability capacitance; Class II is commonly used in bypass, filtering, low-frequency coupling, and high capacitance circuits where stability requirements are not high.
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Over the years, we have been committed to the production, research and development and sales of multilayer ceramic capacitors and EMI filter products. The products are widely used in aerospace, communication equipment, petroleum exploration, medical equipment, electric vehicles, high-end industrial and communication 5G markets.